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Amkor Technology, Inc. (AMKR) 株式分析

テクノロジー

Amkor Technology, Inc.

$73.46

+$7.71 (+11.73%)

最終更新日: 2026年5月26日

株価推移

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分析

企業概要

Amkor Technology, Inc. operates as a leading provider of outsourced semiconductor packaging and test services, with operational facilities strategically located across the United States, Japan, Europe, and the Asia Pacific region. The company specializes in turnkey packaging solutions that encompass a comprehensive suite of services, including semiconductor wafer bumping, wafer probing, wafer back-grinding, package design, full assembly packaging, burn-in testing, and system level integration. This entity functions within the broader Technology sector, specifically classified under the Semiconductor Equipment & Materials industry, which plays a pivotal role in the global supply chain for electronic devices. With a market capitalization of $13.66B, annual revenue of $6.71B, and an employee base of 30,800, the firm demonstrates significant scale within its niche. These valuation and revenue figures indicate that Amkor maintains a substantial position as a major contract manufacturer, serving diverse clients who rely on its specialized capabilities to bring complex semiconductor chips to market efficiently.

財務健全性

The company reported revenue of $6.71B and net income of $373.90M over the trailing twelve months, while EBITDA stood at $1.11B. The substantial gap between the $6.71B revenue and the $373.90M net income highlights a cost structure characterized by significant operating expenses, resulting in a profit margin of 5.6%. Additionally, the gross margin of 14.0% and operating margin of 9.8% reflect the capital-intensive nature of semiconductor manufacturing services where material and labor costs heavily influence profitability. However, the free cash flow stands at -$114,932,128, indicating that the company's capital expenditures or working capital requirements currently exceed its operating cash generation, which limits immediate financial flexibility for large-scale acquisitions without external financing. On the balance sheet, the firm holds $1.99B in cash against $1.67B in debt, supported by a debt-to-equity ratio of 36.97, which suggests a leveraged capital structure typical for asset-heavy manufacturing industries. Despite the leverage, the current ratio of 2.27 indicates robust short-term liquidity, ensuring the company can comfortably meet its obligations due within one year. Management effectiveness is evidenced by a return on equity of 8.7% and a return on assets of 3.9%, metrics that show the company generates reasonable returns on its shareholders' capital and total asset base given its industry peers' typical performance profiles.

バリュエーション評価

Amkor Technology currently trades with a P/E ratio (TTM) of 36.76 and a forward P/E of 24.05. The notable difference between these two metrics implies that the market anticipates a significant acceleration in earnings growth, as the forward multiple is substantially lower than the trailing multiple, suggesting investors expect profitability to expand rapidly in the coming periods. The price-to-book ratio is recorded at 3.05, indicating that the market values the company at more than three times its book value, which often reflects investor confidence in the firm's intangible assets, brand, or future growth potential beyond its tangible net worth. Alternative valuation metrics further contextualize the stock's pricing, with a price-to-sales ratio of 2.04 and an EV/EBITDA of 12.03, suggesting the stock is priced at a premium relative to sales but remains reasonable on an earnings basis when adjusted for enterprise value. Regarding price action, the 52-week high is $57.09 and the 52-week low is $14.59, meaning the current trading price sits significantly below the recent peak, reflecting a period of consolidation or market correction relative to the asset's recent volatility range. The stock carries a beta of 1.95, which signifies that the share price is highly volatile and tends to move with nearly double the magnitude of the broader market, exposing investors to heightened sensitivity during market fluctuations.

Growth & Income

Amkor Technology has demonstrated robust expansion with a revenue growth rate of 15.9% year-over-year and an earnings growth rate of 61.0% year-over-year. The fact that earnings are growing at nearly four times the pace of revenue implies an improving operational leverage and potentially favorable cost dynamics or pricing power that are driving disproportionate profit increases. Regarding income distribution, the company offers a dividend yield of 0.6% with a payout ratio of 22.1%, indicating that the firm returns a modest portion of its earnings to shareholders. The low payout ratio suggests that the company retains the majority of its profits to fund its operations, pay down debt, or invest in capacity expansion rather than distributing high dividends. This conservative payout strategy aligns with the capital-intensive requirements of the semiconductor packaging sector, where reinvestment is often prioritized to maintain technological competitiveness and market share. Overall, the growth and income profile of Amkor Technology is characterized by accelerating profitability, moderate dividend support, and a strategic approach to capital allocation that balances shareholder returns with necessary business reinvestment.

同業他社比較

Amkor Technology, Inc. (AMKR) は半導体製造装置・材料業界で事業を展開しています。時価総額による最も近い同業他社との比較は以下の通りです:

企業名 ティッカー 時価総額 PER
Amkor Technology, Inc. AMKR $18.21B 42.2
ASML Holding N.V. ASML $629.01B 54.4
Lam Research Corporation LRCX $403.53B 61.0
Applied Materials, Inc. AMAT $361.16B 42.8

半導体製造装置・材料業界の平均PERは122.1倍です。Amkor Technology, Inc.のPERは42.2です。

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Amkor Technology, Inc.について

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

企業説明は英語で表示されています。

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主要指標

時価総額
$18.21B
PER
42.22
52週高値
$79.23
52週安値
$17.79
平均出来高
4.29M
ベータ
2.31
配当利回り
0.45%

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企業情報

取引所
NASDAQ
United States
従業員数
30,800