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Amkor Technology, Inc. (AMKR) 股票分析

科技

Amkor Technology, Inc.

$73.46

+$7.71 (+11.73%)

最后更新: 2026年5月26日

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最新新闻

新闻由第三方来源提供。不构成投资建议。

分析

公司概述

Amkor Technology, Inc. operates within the technology sector, specifically serving the semiconductor equipment and materials industry by providing outsourced semiconductor packaging and test services across the United States, Japan, Europe, and the Asia Pacific. The company offers a comprehensive suite of turnkey solutions that encompass semiconductor wafer bumping, wafer probing, wafer back-grinding, package design, full packaging processes, burn-in testing, and system-level integration. In terms of scale, the company commands a market capitalization of $13.66B and generates annual revenue of $6.71B based on trailing twelve-month figures. With an employee base of 30,800, these valuation and revenue metrics indicate that Amkor holds a significant position as a major global provider of critical semiconductor assembly services. The substantial market cap relative to its revenue suggests the market values its specialized manufacturing footprint and global operational reach highly, while the workforce size reflects the capital-intensive nature of the packaging and test business it facilitates for leading semiconductor foundries.

财务健康

The company reported trailing twelve-month revenue of $6.71B with net income of $373.90M and EBITDA of $1.11B, revealing a cost structure where operating expenses and taxes consume a significant portion of gross receipts to arrive at the final profit. The free cash flow stands at $-114,932,128, indicating a period of cash outflow that limits immediate financial flexibility for capital expenditure or dividend growth without external financing. Analysis of the three primary margins shows a gross margin of 14.0%, an operating margin of 9.8%, and a profit margin of 5.6%, which collectively indicate a capital-intensive business model with moderate profitability typical of contract manufacturing. On the balance sheet, the company holds $1.99B in cash against $1.67B in debt, resulting in a debt-to-equity ratio of 36.97, which characterizes a leveraged financial position reliant on equity to support its obligations. The current ratio of 2.27 demonstrates strong short-term liquidity, suggesting the company possesses more than double the current assets needed to cover its current liabilities. Return on equity is recorded at 8.7% while return on assets is 3.9%, metrics that reveal management generates higher returns on shareholder capital compared to the broader asset base, reflecting the financial leverage embedded in the company's structure.

估值评估

Valuation multiples indicate a trailing P/E ratio of 36.76 and a forward P/E of 24.05, where the significant difference implies the market expects a substantial increase in earnings growth over the coming year to justify the lower forward multiple. The price-to-book ratio stands at 3.05, suggesting the market prices the stock at a significant premium over its tangible book value, likely reflecting expectations of future growth in packaging demand. Alternative valuation metrics include a price-to-sales ratio of 2.04 and an EV/EBITDA of 12.03, which provide context on the company's valuation relative to its sales volume and operating earnings before interest, taxes, depreciation, and amortization. The stock has historically traded between a 52-week high of $57.09 and a 52-week low of $14.59, and without a specific current price in the provided facts, the valuation range highlights the equity's historical volatility and recent recovery from the low end of its trading band. The beta value is 1.95, which indicates that the stock price is highly volatile and expected to move with nearly twice the magnitude of the broader market index.

Growth & Income

Amkor Technology has demonstrated robust expansion with revenue growth of 15.9% year-over-year and earnings growth of 61.0% year-over-year, indicating that earnings are growing significantly faster than revenue. This divergence implies potential improvements in margin expansion, operational efficiency, or a favorable product mix shift that allows profitability to outpace top-line growth. Regarding income generation, the company maintains a dividend yield of 0.6% with a payout ratio of 22.1%, indicating that the dividend is currently well-covered by earnings and appears sustainable given the low payout percentage relative to the high earnings growth rate. The low payout ratio combined with strong earnings growth suggests the company retains a majority of its profits for reinvestment into its manufacturing facilities and technology upgrades rather than distributing them entirely to shareholders. Overall, the growth and income profile presents a scenario of accelerating profitability supported by a conservative dividend policy that prioritizes internal capital allocation for long-term capacity expansion.

同行比较

Amkor Technology, Inc. (AMKR) 在半导体设备与材料行业运营。以下是其与市值最接近的同行的比较:

公司 代码 市值 市盈率
Amkor Technology, Inc. AMKR $18.21B 42.2
ASML Holding N.V. ASML $629.01B 54.4
Lam Research Corporation LRCX $403.53B 61.0
Applied Materials, Inc. AMAT $361.16B 42.8

半导体设备与材料行业平均市盈率为122.1倍。Amkor Technology, Inc.的市盈率为42.2。

本分析由AI生成,仅供参考,不构成投资建议。数据可能存在延迟或不准确。在做出投资决策之前,请务必进行自己的研究并咨询合格的财务顾问。

关于Amkor Technology, Inc.

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

公司简介以英文显示。

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关键指标

市值
$18.21B
市盈率
42.22
52周最高
$79.23
52周最低
$17.79
平均成交量
4.29M
Beta系数
2.31
股息率
0.45%

数据由Yahoo Finance通过yfinance提供。每日更新。

公司信息

交易所
NASDAQ
国家
United States
员工数
30,800